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Technology Menu
Single Sided, Double Sided & Multilayer Cross Sections
Mixed Dielectrics Including PTFE with FR4
Blind & Buried Vias
Sequential Laminations
Steps and Cavities for SMT Directly on Buried Stripline Layers
Laser Profiling for Square Corner Cuts & Precision Feature to Edge Control
Solder Mask & Solder Dam Over Bare Copper
Thin and Thick Board Processing 2 to 200+ mils
Thick Copper Backed Boards
Standard Electrical Test at 250V
- Up to 500V Test Available
Screened Resistors with Laser Trim
Counter Bore & Countersink Drilling
Back Drilling to Remove Tuning Stub Vias
Copyright © 2004 MCT. All Rights Reserved.
Microwave Circuit Technology, Inc.
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