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Surface Finishes
Bare Copper (Non-OSP)
Hot Air Solder Leveling (HASL)
Electroless Nickel Immersion Gold (ENIG)
Electroplate Nickel Gold (EGold)
- MIL-G-45204 Type III Grade A – Soft Wirebondable
- Selective Pattern & Multiple Thickness – XRF Certified
Electroplate Tin
Immersion Tin .....
Copyright © 2004 MCT. All Rights Reserved.
Microwave Circuit Technology, Inc.
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