New Technology Development
Advanced Electrolytic Acid Copper Plating
M. E. Baker Plating Cell with Advanced Fluid Mechanics
Dutch Reverse Pulse Plating (DRPP) Rectifiers
Technic Acid Plating Chemistry
We Have Selected These Three Suppliers to Provide MCT with Advanced Copper Plating Technology. We Can Offer Customers Improved Surface Copper Uniformity Across the Circuit Board as well as Increased Via Plating Thickness & Higher Aspect Ratio Plating Capability for Both Through Vias and Blind Vias.
Rogers R/flex 3000 Liquid Crystal Polymer (LCP) Materials
Single & Double Sided
Multilayer Laminations
A New, Highly Advanced Circuit Board Material with Dielectric Properties Suitable for Micro-miniature High Frequency Applications such as sensors and antennas.
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Microwave Circuit Technology, Inc.
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