 |
Bare Copper (Non-OSP) |
|
Hot Air Solder Leveling (HASL) |
|
Electroless Nickel Immersion Gold (ENIG) |
|
Electroplate Nickel Gold (EGold) |
|
MIL-G-45204 Type III Grade A - Soft Wirebondable |
| |
|
Selective Pattern & Multiple Thickness – XRF Certified |
|
|
Electroplate Tin |
|
Immersion Tin |
|
Immersion Silver |
