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Single Sided, Double Sided & Multilayer Cross Sections |
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Mixed Dielectrics Including PTFE with FR4 |
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Blind & Buried Vias |
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Sequential Laminations |
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Steps and Cavities for SMT Directly on Buried Stripline Layers |
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Laser Profiling for Square Corner Cuts & Precision Feature to Edge Control Solder Mask & Solder Dam Over Bare Copper |
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Thin and Thick board
Processing 1 to 300 + mils |
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Thick Copper Backed Boards |
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Standard Electrical Test at 250V |
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Up to 500V Test Available |
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Screened Resistors with Laser Trim |
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Buried Discrete Resistors |
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Counter Bore & Countersink Drilling |
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Back Drilling to Remove Tuning Stub Vias |
